PLATING RESIST MR-303F油墨

                    PLATING RESIST MR-303F是適合用于部分鍍金用的遮蔽的單液性, 堿性剝離型抗鍍油墨.此外也適合用于ITO用的蝕刻油墨.

                     
                    PLATING RESIST MR-303F is one component, alkaline removable type Resist Ink developed for masking of partial Au plating.
                    Moreover, it is possible to be used as etching ink for ITO.

                    Main Feature
                    1. Cured film has flexibility, and available for a flexible board and a rigid board.
                    2. This ink has excellent resistance to Au plating( Electro-less),since the contamination to the plating solution
                    is very small, control of the solution is easy.
                    3. Possible to be used as etching ink for ITO.

                    Main Property

                    Items Representing value Remarks
                    Color Black color Visual
                    Viscosity at 25 deg.C 200 dPa・s Viscotester VT-04
                    Applicable Screen 150~250 Mesh Polyester Screen
                    Optimum Ink thickness after drying 10~20µm Thickness Meter
                    Dry Conditions 100deg.C × 10min Circulating Heat Oven
                    Adhesion 100 / 100 Cross-cut,tape peel test
                    Resistance to Electro-less Plating No penetration, No color change Ni Plating at 90deg.C for 30 min + Au Plating at 90deg.C for 40 min
                    Remove of the cured film 1~3 wt% NaOH Solution 30deg.C × 1~3 min Dipping

                    The above information obtained by actual measurement at our lab., and do not specified values.
                    < Shelf-life > Main body: 6 months --- Stored in 25 deg.C or below (cool and dark place).
                    Usage and handling precautions
                    1. If dilution is needed due to viscosity variation during operation, dilute with exclusive reducer #70 within 5%.
                    2. Drying should be done at the range of 100deg.C~130deg.C. Since drying time will vary based on s heat efficiency and ventilation capacity of used oven, please confirm your oven and set optimum condition.
                    3. This resist can be used for general Ni/Au plating solution without any inconvenience.

                    However, if it is used for special plating solution, it may cause the change in characteristics, depending on its composition. Please use it after checking fully.

                    Flexibility test (JIS K 5600-5-1)

                    Mandrel diameter 8mmφ 6mmφ 4mmφ 3mmφ 2mmφ
                    Conventional products No Crack Crack Crack Crack Crack
                    MR-303F No Crack No Crack No Crack No Crack No Crack

                    Test board: Thickness 25µm/PI film
                    Screen mesh: 200mesh polyester screen
                    Dry condition: 100deg.C × 10min Circulating Heat Oven
                    Ink thickness after drying: Thickness 14~16µm

                    Elusion amount in Electro-less Ni Plating 

                     

                     ・Absorbance is high=Quantity of elution is large ・Absorbance is low=Quantity of elution is small Compared to Ni Plating new solution, absorbance peak which arise from elusion content from coated film can be confirmed at around 280nm for conventional product though, the peak can not be confirmed in MR-303F.

                    <<Sample manufacture condition>>
                    Test Board: 5.6cm×4cm /PI film/4 pieces
                    Dry condition: 100deg.C × 10min Circulating Heat Oven
                    Ink thickness after drying: About 30µm
                    <<Ni plating condition>>
                    Plating solution: Product made by OKUNO CHEMICAL INDUSTRIES CO.,LTD
                    Dip condition: 80 deg.C × 4hr
                    <<Measurement condition>>
                    Testing equipment: Product made in SHIMADZU CORPORATION UV-1800
                    Kind of measurements: Absorbance
                    Measurement wavelength(nm): 200~900

                    ITO-proof etching liquid test 

                    <<Sample manufacture condition>>
                    Test Board: ITO/PET film
                    Screen mesh: 200mesh polyester screen
                    Dry condition: 100deg.C × 10min Circulating Heat Oven
                    Ink thickness after drying: Thickness 10~15µm

                    ≪ITO etching liquid condition≫
                    Etching solution: Mixed acid ITO-02 Product made by KANTO CHEMICAL CO.,INC.
                    Dip condition: 45deg.C × 4min
                     ≪Remove of the cured film≫
                    Remove solution: 3wt%NaOH
                    Dip condition: 30 deg.C × 1min
                    ≪Measuring instrument condition≫
                    Measuring instrument Product made by YOKOGAWA ELECTRIC CORPORATION DEGITAL MLTIMETER 755S

                    Stripping test after thermal resistance 


                    <<Sample manufacture condition>>
                    Test Board: PI film・ Glass epoxy copper foil
                    Screen mesh: 200mesh polyester screen
                    Dry condition: 100deg.C × 10min Circulating Heat Oven
                    Ink thickness after drying: Thickness 10~15µm
                    Additional heating condition: 180℃×1-5hr/ Heat circulation oven
                    ≪Remove of the cured film≫
                    Remove solution: 3wt%NaOH
                    Dip condition: 30 deg.C × 1min
                    Check strippability: Visual

                     

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